采用DIP16(LF1)封装的光耦Specification of DIP16(LF1) package
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Toshiba Code |
11-20A301 |
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|---|---|---|
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Mounting |
Surface Mount |
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| Pins |
16 |
|
|
Weight (typ.) |
1.1 g |
|
|
Packing Method |
Magazine |
|
|
Minimum Quantity |
25 pcs/Magazine |
|
|
Package Dimensions (mm) / Land Pattern Example (mm) |
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|
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MagazineDimensions (mm) |
Thickness: 0.5 mm |
A: Magazine, B: Stopper |
